Bonding Scholarship
"Value of Awards
The scholarship covers tuition fee, library fee, lab fee, workshop fee, student activities fee, insurance fee, exam fee and hostel accommodation"
INSTITUTION
INTAKES
January
EDUCATION LEVELS
Degree
CRITERIAS
Eligibility Requirements
Malaysian citizen
Below 25 years old on date of application
Strong leadership skills & active participation in extra curriculum, social and volunteer activities
Full-time student
Non-employed candidate
Must not be sponsored by other financial institutions
The candidate is required to serve an employment bond of 5 + 2 years with DRB-HICOM Group of Companies
Minimum Requirements
SPM/SPMV candidates with minimum 5 As inclusive of Mathematics and English
